JPH0319230Y2 - - Google Patents

Info

Publication number
JPH0319230Y2
JPH0319230Y2 JP1983099161U JP9916183U JPH0319230Y2 JP H0319230 Y2 JPH0319230 Y2 JP H0319230Y2 JP 1983099161 U JP1983099161 U JP 1983099161U JP 9916183 U JP9916183 U JP 9916183U JP H0319230 Y2 JPH0319230 Y2 JP H0319230Y2
Authority
JP
Japan
Prior art keywords
metal plate
lead wire
metal plates
opposing sides
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983099161U
Other languages
English (en)
Japanese (ja)
Other versions
JPS606253U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983099161U priority Critical patent/JPS606253U/ja
Publication of JPS606253U publication Critical patent/JPS606253U/ja
Application granted granted Critical
Publication of JPH0319230Y2 publication Critical patent/JPH0319230Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1983099161U 1983-06-27 1983-06-27 ブリツジ型半導体装置 Granted JPS606253U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983099161U JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983099161U JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Publications (2)

Publication Number Publication Date
JPS606253U JPS606253U (ja) 1985-01-17
JPH0319230Y2 true JPH0319230Y2 (en]) 1991-04-23

Family

ID=30235116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983099161U Granted JPS606253U (ja) 1983-06-27 1983-06-27 ブリツジ型半導体装置

Country Status (1)

Country Link
JP (1) JPS606253U (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620773B2 (ja) * 2010-09-28 2014-11-05 新電元工業株式会社 樹脂封止型半導体装置
JP5820696B2 (ja) * 2011-11-07 2015-11-24 新電元工業株式会社 半導体装置の製造方法及び半導体装置の製造用治具
PH22021550004U3 (en) * 2019-03-25 2023-05-05 Shindengen Electric Mfg Semiconductor apparatus, lead frame, and power source apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2738218A1 (de) * 1977-08-24 1979-03-01 Siemens Ag Verfahren zum herstellen einer halbleiteranordnung

Also Published As

Publication number Publication date
JPS606253U (ja) 1985-01-17

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